Sn-Co 및 Sn-Fe계 금속간화합물 형성을 이용한 고온안정성 천이액상소결접합에 관한 연구

Abstract

In this study, a study was conducted to evaluate the manufacturing and characteristics of power semiconductor chip bonding paste that can be used at high temperatures. The Sn-Co paste and Sn-Fe paste were prepared by varying the particle content in consideration of printability. Observation of the microstructure change of the junction showed that Sn remained in the junction for 1 hour, causing a problem, and a sufficient reaction between Sn and the particles occurred in the junction for 2 hours and 3 hours. In addition, a mechanical strength test according to the change in process time was performed. As a result of bonding strength measurement, it was measured at 25-30 Mpa and high shear strength was observed. After the TLPS bonding process, the bonding part was composed of Sn-Co, Ni intermetallic compounds, Sn-Fe, and Ni intermetallic compounds, respectively, and voids were formed in the bonding part regardless of the process time.