이중중합형 접착제가 상아질 결합강도와 중합률에 미치는 영향
- Author(s)
- 전지훈
- Issued Date
- 2008
- Abstract
- ABSTRACT
Influence of dual-cured adhesive system
on dentin bond strength and degree of conversion
Cheon, Ji-Hoon
Advisor : Prof. Min, Jeong-Bum D.D.S, Ph.D.
Department of Dentistry
Graduate School of Chosun University
The purpose of this study was to evaluate the microtensile bond strength (𝛍TBS) and degree of conversion (DC) of two light cured adhesive systems [Prime&Bond NT / X-P Bond] used in light-cured and dual-cured versions.
For microtensile bond strength (𝛍TBS) measurement, occlusal dentin surface of 28 human molars were exposed and flattened. Teeth were assigned to 1 of the following 4 groups (n=8) according to adhesive systems: 2 light cured adhesive systems [Prime& Bond NT (P), X-P Bond (X)], 2 dual cured adhesive systems [Prime&Bond NT with Self-cure Activator (PA), X-P Bond with Self-cure Activator (XA)]. The acid etching and adhesive systems were applied according to the manufacturer's directions and composite resin were built-up on the surface. The teeth were stored in distilled water for 24 hours and serially sectioned mesio-distally, bucco-lingually to obtain test blocks (1 mm2 ? 8 mm). The 𝛍TBS were measured in a Microtensile tester. The degree of conversion (DC) was monitored with a Fourier trasform infrared spectrometer (FTIR) device. Data were analyzed by One-way ANOVA and Tukey HSD test (p < 0.05).
The results were as follows:
1. In 𝛍TBS test, Mean Microtensile bond strength (MPa) for experimental
groups were as follow: 23.68 MPa (P), 21.48 MPa (PA), 27.18 Mpa (X),
24.95 MPa (XA).
2. DC of the groups were as follow: 22.2% (P), 19% (PA), 41% (X), 31%
(XA).
3. The light curing groups (P, X) had significantly higher 𝛍TBS and DC
values than the dual curing groups (PA, XA) (p < 0.05).
4. In all adhesive systems, X-P bond (X) had significantly higher 𝛍TBS
and DC values than the Prime&Bond NT (P) (p < 0.05).
In conclusion, adhesive systems mixing with Self-cure Activator was
not improved the DC and the bond strength.
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