다이아몬드 기구로 삭제한 와동에서 2단계 접착제의 미세누출 비교

Abstract

The purpose of this study was to compare the marginal microleakage of different 2-step adhesive systems in Class V cavities prepared with different diamond points. Forty Class V cavities were prepared with two different (coarse or fine) diamond points on cervical third of extracted molars. The occlusal and gingival margin of cavities was located in enamel and dentin, respectively. They were divided into one of four equal groups (n=10) and ; Group 1-prepared with coarse diamond point (EX-41) and restored with Single Bond and Z 250, Group 2-prepared with fine diamond piont (TF-21F), and restored with Single Bond and Z 250, Group 3-prepared with coarse diamond point (EX-41) and restored with Clearfil SE Bond and Clearfil AP-X, Group 4-prepared with fine diamond point (TF-21F) and restored with Clearfil SE Bond and Clearfil AP-X. Specimens were thermocycled, immersed in a 2% methylene blue solution for 24 hours, and bisected longitudinally. They were observed leakages at enamel and dentinal margins. Data were analyzed using Mann-Whitney and Wilcoxon signed ranked test. The results of this study were as follows; 1. At both enamel and dentinal margin, microleakage of group 3 was statistically higher than those of group 1, 2 and 4 (p < 0.01). 2. There were not statistically different among the microleakage of group 1, 2 and 4 at both enamel and dentinal margin (p < 0.01). 3. Enamel microleakage was statistically higher than dentinal microleakage in all groups (p <0.05). In conclusion, marginal microleakage of Single Bond was not affected by type of diamond points. But Clearfil SE Bond showed higher marginal microleakage at both enamel and dentinal margin when Class V cavity was prepared with coarse diamond point.