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삭제기구의 종류에 따른 ClearfilTM SE Bond의 법랑질에 대한 미세전단 결합강도

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Author(s)
정진호
Issued Date
2006
Abstract
The purpose of this study was to compare the microshear bond strength (μSBS) to enamel prepared with different burs when a self-etching primer adhesive was used and to determine what type of bur are chosen to provide good bonding to enamel surface.
Forty-two human molars were sectioned to partially expose buccal or lingual enamel of crowns with Isomet Low Speed Saw and slabs of 1.2 mm thick were made.
Enamel surfaces of about 0.2 mm thickness were removed with different four diamond burs and two carbide burs. They were divided into one of six equal groups (n=7); Group 1: coarse (125-150 ㎛) diamond bur, Group 2: standard (106-125 ㎛) diamond bur, Group 3: fine (53-63 ㎛) diamond bur, Group 4: extrafine (20-30 ㎛) diamond bur, Group 5: plain-cut carbide bur (no. 245), Group 6: cross-cut carbide bur (no. 557).
ClearfilTM SE Bond was applied to enamel surface and Clearfil AP-X was bonded to enamel suface using Tygon tubes. After storage in distilled water for 24 hours, the bonded specimens were subjected to μSBS testing with a crosshead speed of 1mm/min. The mean μSBS (n=20 for each group) was statistically compared using one-way ANOVA and Tukey HSD test.
The results of this study were as follows;
1. The μSBS of Group 1 was the lowest among groups and it was statistically significant lower than that of Group 4 and 5 ( p < 0.05).
2. The μSBS of Group 4 was the highest among groups and it was significantly higher than that of Group 1, 2, 3, and 6 ( p < 0.05), but no significant difference than that of Group 5 (p > 0.05).
3.There was not statistically significant different between Group 5 and 6 (p > 0.05).
In conclusion, the enamel surfaces prepared with different burs were affected to the microshear bond strength between a self-etch primer adhesive and enamel surface. The use of extrafine diamond and plain-cut carbide bur are recommended for the good bonding of ClearfilTM SE Bond to enamel.
Alternative Title
Microshear bond strength of ClearfilTM SE Bond to enamel according to the type of bur
Alternative Author(s)
Jeong, Jin-Ho
Affiliation
조선대학교 대학원
Department
일반대학원 치의학과
Advisor
조영곤
Awarded Date
2006-08
Table Of Contents
ABSTRACT = ⅲ
Ⅰ. 서론 = 1
Ⅱ. 실험재료 및 방법 = 3
Ⅲ. 실험결과 = 6
Ⅳ. 총괄 및 고찰 = 8
Ⅴ. 결론 = 11
참고문헌 = 12
Degree
Doctor
Publisher
조선대학교 대학원
Citation
정진호. (2006). 삭제기구의 종류에 따른 ClearfilTM SE Bond의 법랑질에 대한 미세전단 결합강도.
Type
Dissertation
URI
https://oak.chosun.ac.kr/handle/2020.oak/6374
http://chosun.dcollection.net/common/orgView/200000232954
Appears in Collections:
General Graduate School > 4. Theses(Ph.D)
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  • Embargo2008-09-10
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