초음파 진동을 이용한 전기화학 폴리싱의 가공특성 연구

Abstract

Various fields in academia and industry rely on highly precise machining and polishing techniques for product and device fabrication. In this study, we demonstrated a novel hybrid surface-polishing process that combines conventional electrochemical polishing(ECP) and external ultrasonic vibration. This combined approach is referred to as vibration electrochemical polishing(VECP). Conventional ECP is a non-contact surface polishing method used to improve surface quality without leaving the mechanical scratch marks often encountered in mechanical processes. However, micropits can form during ECP, due to bubble formation or impurities in the material. These micropits degrade the surface quality and durability of the machined part. Additionally, the micropit areas are susceptible to corrosion and bacteria build-up, a serious problem in fields requiring ultra-clean, sterilized equipment and environments. This study verifies improved results with VECP compared with conventional ECP. The localized roughness of the work material was measured by atomic force microscopy(AFM) and scanning electron microscopy(SEM). In addition to surface roughness, we compared the overall surface quality, material removal rate(MRR), and productivity of ECP with those of VECP.