광 감도 비교를 통한 전자처리 스페클 패턴 간섭계의 최적 측정 조건에 대한 연구

Abstract

The Electronic speckle pattern interferometry is one of the optical nondestructive testing technique. Current, non-destructive inspection technology is using industrial machinery, nuclear power plants, heavy plant, shipbuilding ships, aircraft, cars in the field of safety diagnostic tests. One of the non-destructive testing techniques ESPI is best suited for the development and testing of complex components and structures in electronics, automobile design, machining and materials research. It is ideal for the experimental verification of analytical and numerical calculation techniques Purpose of study, by comparing the light sensitivity in measuring the plane deformation of an object, is to obtain the reliability of the out-of-plane deformation interferometer. A study on the optimum conditions is compared the photosensitivity for ensure reliability to the comparison and verification through the Shearography. and Electronic Speckle Pattern Interferometry Sherography system is a commercial one from Dantec Dynacmics, German (Q-800 model), and it is composed of shearography sensor, diode laser inside of sensor, controller, and PC. Amount of shear is given in Y direction as 5 mm (0.333mm/pixel), and system utilizes commercial program, ISTRA 4D, for equipment control and filtering/grain treatment. In this paper, photosensitivity measurement interferometer using a Electronic Speckle Pattern Interferometry theory develope and verify through a comparative experiment of photosensitivity Devices capable of determining the reference value develope and through the experiment, effective quantitative detection method offer Using the test method proposed in this paper, the size of the internal defects, shape, check the position with high resolution inspect, the concept of quantitative non-destructive evaluation that is basis to product reliability, safety, health will meet. So laser speckle interferometry will be expected reliable non-destructive inspection